Surface Mount Adhesive

Typical application Mainly used for STM bonding components. Recommend cure condition:120 90-120s or 150 60-0sHeat-resisting strength (sample curing at 150 30minAL/AL shear strength under appropriate temperature test Store 2~8 dry sealed storage, shelf life is 6 months. Higher curing temperatures and longer curing time will get a better bond strength The curves for the recommended curing temperature and heating rate, show when the components reach a good adhesion needs time at the corresponding temperature. Users can set the oven temperature according the curing curves and oven efficiency